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slvs060k ? june 1976 ? revised april 2005 1 post office box 655303 ? dallas, texas 75265 3-terminal regulators output current up to 500 ma no external components high power-dissipation capability internal short-circuit current limiting output transistor safe-area compensation a79m05, a79m08 . . . ktp package (top view) output input common input output a79m05 . . . kc (to-220) package (top view) common input input output a79m05 . . . kcs (to-220) package (top view) common input input description/ordering information this series of fixed-negative-voltage integrated-circuit voltage regulators is designed to complement the a78m00 series in a wide range of applications. these applications include on-card regulation for elimination of noise and distribution problems associated with single-point regulation. each of these regulators delivers up to 500 ma of output current. the internal current-limiting and thermal-shutdown features of these regulators essentially make them immune to overload. in addition to use as fixed-voltage regulators, these devices can be used with external components to obtain adjustable output voltages and currents, and also as the power-pass element in precision regulators. ordering information t j v o (nom) (v) package ? orderable part number top-side marking powerflex ? (ktp) reel of 3000 a79m05cktpr a79m05c 0 c to 125 c ?5 to-220 (kc) tube of 50 a79m05ckc a79m05c 0 c to 125 c ?5 to-220, short shoulder (kcs) tube of 20 a79m05ckcs a79m05c ?8 powerflex (ktp) reel of 3000 a79m08cktpr a79m08c ? package drawings, standard packing quantities, thermal data, symbolization, and pcb design guidelines are available at www.ti.com/sc/package. please be aware that an important notice concerning avail ability, standard warranty, and use in critical applications of texas instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. copyright ? 2005, texas instruments incorporated powerflex is a trademark of texas instruments.
slvs060k ? june 1976 ? revised april 2005 2 post office box 655303 ? dallas, texas 75265 schematic 4.5 k ? to 6.3 k ? common output input 0.1 ? 0.2 ? 1.7 k ? to 18 k ? resistor values shown are nominal. absolute maximum ratings over virtual junction temperature range (unless otherwise noted) ? input voltage, v i 35 v . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . operating virtual junction temperature, t j 150 c . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . lead temperature 1,6 mm (1/16 inch) from case for 10 seconds 260 c . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . storage temperature range, t stg ?65 c to 150 c . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ? stresses beyond those listed under ?absolute maximum ratings? may cause permanent damage to the device. these are stress ratings only, a nd functional operation of the device at these or any other conditions beyond those indicated under ?recommended operating conditi ons? is not implied. exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. package thermal data (see note 1) package board jc ja jp ? powerflex (ktp) high k, jesd 51-5 19 c/w 28 c/w 1.4 c/w to-220 (kc/kcs) high k, jesd 51-5 17 c/w 19 c/w 3 c/w note 1: maximum power dissipation is a function of t j (max), ja , and t a . the maximum allowable power dissipation at any allowable ambient temperature is p d = (t j (max) ? t a )/ ja . operating at the absolute maximum t j of 150 c can affect reliability. ? for packages with exposed thermal pads, such as qfn, powerpad, or powerflex, jp is defined as the thermal resistance between the die junction and the bottom of the exposed pad.
slvs060k ? june 1976 ? revised april 2005 3 post office box 655303 ? dallas, texas 75265 recommended operating conditions min max unit v i input voltage a79m05c ?7 ?25 v v i input voltage a79m08c ?10.5 ?25 v i o output current 500 ma t j operating virtual junction temperature 0 125 c electrical characteristics at specified virtual junction temperature, v i = ?10 v, i o = 350 ma, t j = 25 c (unless otherwise noted) parameter test conditions ? a79m05c unit parameter test conditions ? min typ max unit output voltage v i = ?7 v to ?25 v, i o = 5 ma to 350 ma ?4.8 ?5 ?5.2 v output voltage v i = ?7 v to ?25 v, i o = 5 ma to 350 ma t j = 0 c to 125 c ?4.75 ?5.25 v input voltage regulation v i = ?7 v to ?25 v 7 50 mv input voltage regulation v i = ?8 v to ?18 v 3 30 mv ripple rejection v i = ?8 v to ?18 v, i o = 100 ma, t j = 0 c to 125 c 50 db ripple rejection v i = ?8 v to ?18 v, f = 120 hz i o = 300 ma 54 60 db output voltage regulation i o = 5 ma to 500 ma 75 100 mv output voltage regulation i o = 5 ma to 350 ma 50 mv temperature coefficient of output voltage i o = 5 ma, t j = 0 c to 125 c ?0.4 mv/ c output noise voltage f = 10 hz to 100 khz 125 v dropout voltage 1.1 v bias current 1 2 ma bias current change v i = ?8 v to ?18 v, t j = 0 c to 125 c 0.4 ma bias current change i o = 5 ma to 350 ma, t j = 0 c to 125 c 0.4 ma short-circuit output current v i = ?30 v 140 ma peak output current 0.65 a ? pulse-testing techniques maintain t j as close to t a as possible. thermal effects must be taken into account separately. all characteristics are measured with a 2- f capacitor across the input and a 1- f capacitor across the output.
slvs060k ? june 1976 ? revised april 2005 4 post office box 655303 ? dallas, texas 75265 electrical characteristics at specified virtual junction temperature, v i = ?19 v, i o = 350 ma, t j = 25 c (unless otherwise noted) parameter test conditions ? a79m08c unit parameter test conditions ? min typ max unit output voltage v i = ?10.5 v to ?25 v, i o = 5 ma to 350 ma ?7.7 ?8 ?8.3 v output voltage v i = ?10.5 v to ?25 v, i o = 5 ma to 350 ma t j = 0 c to 125 c ?7.6 ?8.4 v input voltage regulation v i = ?10.5 v to ?25 v 8 80 mv input voltage regulation v i = ?11 v to ?21 v 4 50 mv ripple rejection v i = ?11.5 v to ?21.5 v, i o = 100 ma, t j = 0 c to 125 c 50 db ripple rejection v i = ?11.5 v to ?21.5 v, f = 120 hz i o = 300 ma 54 59 db output voltage regulation i o = 5 ma to 500 ma 90 160 mv output voltage regulation i o = 5 ma to 350 ma 60 mv temperature coefficient of output voltage i o = 5 ma, t j = 0 c to 125 c ?0.6 mv/ c output noise voltage f = 10 hz to 100 khz 200 v dropout voltage i o = 5 ma 1.1 v bias current 1 2 ma bias current change v i = ?10.5 v to ?25 v, t j = 0 c to 125 c 0.4 ma bias current change i o = 5 ma to 350 ma, t j = 0 c to 125 c 0.4 ma short-circuit output current v i = ?30 v 140 ma peak output current 0.65 a ? pulse-testing techniques maintain t j as close to t a as possible. thermal effects must be taken into account separately. all characteristics are measured with a 2- f capacitor across the input and a 1- f capacitor across the output.
package option addendum www.ti.com 21-may-2013 addendum-page 1 packaging information orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ball finish msl peak temp (3) op temp (c) device marking (4/5) samples 7704001ha obsolete cfp u 10 tbd call ti call ti -55 to 125 ua79m05ckc obsolete to-220 kc 3 tbd call ti call ti 0 to 125 ua79m05c UA79M05CKCE3 obsolete to-220 kc 3 tbd call ti call ti 0 to 125 ua79m05c ua79m05ckcs active to-220 kcs 3 50 pb-free (rohs) cu sn n / a for pkg type 0 to 125 ua79m05c ua79m05ckcse3 active to-220 kcs 3 50 pb-free (rohs) cu sn n / a for pkg type 0 to 125 ua79m05c ua79m05cktpr obsolete pfm ktp 2 tbd call ti call ti 0 to 125 ua79m05c ua79m05cktprg3 obsolete pfm ktp 2 tbd call ti call ti 0 to 125 ua79m05c ua79m05ckvurg3 active to-252 kvu 3 2500 green (rohs & no sb/br) cu sn level-3-260c-168 hr 0 to 125 79m05c ua79m05mub obsolete cfp u 10 tbd call ti call ti -55 to 125 ua79m08ckc obsolete to-220 kc 3 tbd call ti call ti 0 to 125 ua79m08cktpr obsolete pfm ktp 2 tbd call ti call ti 0 to 125 ua79m08c ua79m08cktprg3 obsolete pfm ktp 2 tbd call ti call ti 0 to 125 ua79m08c ua79m08ckvurg3 active to-252 kvu 3 2500 green (rohs & no sb/br) cu sn level-3-260c-168 hr 0 to 125 79m08c (1) the marketing status values are defined as follows: active: product device recommended for new designs. lifebuy: ti has announced that the device will be discontinued, and a lifetime-buy period is in effect. nrnd: not recommended for new designs. device is in production to support existing customers, but ti does not recommend using this part in a new design. preview: device has been announced but is not in production. samples may or may not be available. obsolete: ti has discontinued the production of the device. (2) eco plan - the planned eco-friendly classification: pb-free (rohs), pb-free (rohs exempt), or green (rohs & no sb/br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. tbd: the pb-free/green conversion plan has not been defined. pb-free (rohs): ti's terms "lead-free" or "pb-free" mean semiconductor products that are compatible with the current rohs requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. where designed to be soldered at high temperatures, ti pb-free products are suitable for use in specified lead-free processes. pb-free (rohs exempt): this component has a rohs exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. the component is otherwise considered pb-free (rohs compatible) as defined above. green (rohs & no sb/br): ti defines "green" to mean pb-free (rohs compatible), and free of bromine (br) and antimony (sb) based flame retardants (br or sb do not exceed 0.1% by weight in homogeneous material)
package option addendum www.ti.com 21-may-2013 addendum-page 2 (3) msl, peak temp. -- the moisture sensitivity level rating according to the jedec industry standard classifications, and peak solder temperature. (4) there may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) multiple device markings will be inside parentheses. only one device marking contained in parentheses and separated by a "~" will appear on a device. if a line is indented then it is a continuation of the previous line and the two combined represent the entire device marking for that device. important information and disclaimer: the information provided on this page represents ti's knowledge and belief as of the date that it is provided. ti bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. efforts are underway to better integrate information from third parties. ti has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ti and ti suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. in no event shall ti's liability arising out of such information exceed the total purchase price of the ti part(s) at issue in this document sold by ti to customer on an annual basis.
tape and reel information *all dimensions are nominal device package type package drawing pins spq reel diameter (mm) reel width w1 (mm) a0 (mm) b0 (mm) k0 (mm) p1 (mm) w (mm) pin1 quadrant ua79m05ckvurg3 to-252 kvu 3 2500 330.0 16.4 6.9 10.5 2.7 8.0 16.0 q2 ua79m08ckvurg3 to-252 kvu 3 2500 330.0 16.4 6.9 10.5 2.7 8.0 16.0 q2 package materials information www.ti.com 29-may-2013 pack materials-page 1
*all dimensions are nominal device package type package drawing pins spq length (mm) width (mm) height (mm) ua79m05ckvurg3 to-252 kvu 3 2500 340.0 340.0 38.0 ua79m08ckvurg3 to-252 kvu 3 2500 340.0 340.0 38.0 package materials information www.ti.com 29-may-2013 pack materials-page 2

mechanical data mpsf001f ? january 1996 ? revised january 2002 1 post office box 655303 ? dallas, texas 75265 ktp (r-psfm-g2) powerflex ? plastic flange-mount package 0.228 (5,79) 0.218 (5,54) 0.233 (5,91) 0.243 (6,17) 0.001 (0,02) 0.005 (0,13) 0.070 (1,78) seating plane 0.080 (2,03) 0.010 (0,25) nom gage plane 0.010 (0,25) 4073388/m 01/02 0.037 (0,94) 0.047 (1,19) 0.247 (6,27) 0.237 (6,02) nom 0.215 (5,46) 0.371 (9,42) 0.381 (9,68) 0.090 (2,29) 0.100 (2,54) 0.287 (7,29) 0.031 (0,79) 0.032 (0,81) max 0.277 (7,03) 0.025 (0,63) 0.130 (3,30) nom 0.090 (2,29) 0.180 (4,57) m 0.010 (0,25) 0.004 (0,10) 2 ? 6 0.040 (1,02) 0.050 (1,27) thermal tab (see note c) 0.010 (0,25) nom notes: a. all linear dimensions are in inches (millimeters). b. this drawing is subject to change without notice. c. the center lead is in electrical contact with the thermal tab. d. dimensions do not include mold protrusions, not to exceed 0.006 (0,15). e. falls within jedec to-252 variation ac. powerflex is a trademark of texas instruments.

www.ti.com package outline 9.25 9.05 6.5 6.1 2.9 2.6 10.36 9.96 13.12 12.70 3x 3.9 max 3x 1.36 1.23 3x 0.90 0.77 ( ) 3.84 5.08 2x 2.54 8.55 8.15 12.5 12.1 (6.3) 19.65 max 4.7 4.4 1.32 1.22 2.79 2.59 0.47 0.34 4222214/a 10/2015 to-220 - 19.65 mm max height kcs0003b to-220 notes: 1. all controlling linear dimensions are in inches. dimensions in brackets are in millimeters. any dimension in brackets or parenthesis are for reference only. dimensioning and tolerancing per asme y14.5m. 2. this drawing is subject to change without notice. 3. reference jedec registration to-220. 1 3 scale 0.850
www.ti.com example board layout 0.07 max all around 0.07 max all around (1.7) 3x ( ) 1.2 (2.54) (5.08) r ( ) 0.05 2x ( ) metal 1.7 2x solder mask opening 4222214/a 10/2015 to-220 - 19.65 mm max height kcs0003b to-220 land pattern example non-solder mask defined scale:15x 1 2 3 opening solder mask

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